Likely Snapdragon 670 specs surfaces Online

Qualcomm announced their powerful and power efficient Snapdragon 845 back in December last year, and now all attention is now focused on low-end Snapdragon 670 chipset, headlining Qualcomm 600- series chips. The Chipset is likely to succeed the power efficient Snapdragon 660 chipset and now what could be the Snapdragon 670 specs has been leaked by WinFuture in their report.

According to reports, the Snapdragon 670 chipset will be built on 10nm process, bringing it on the same level with the more powerful and power efficient high-end Snapdragon 835 and Samsung Exynos 8895.


Qualcomm chipset

Onboard the Snapdragon 670 chipset specs, there will be a Modified Cortex A55 cluster with 6-high efficiency cores likely to be called Kryo 300 Silver. However, the high performance cluster will comprise of 2 Cortex A75 cores likely to be called Kryo 300 Gold. The efficient core is expected to clock at 1.7GHz frequency, while the higher performance core will clock at 2.6GHz. Since the SD 670 is only breaching the gap between Snapdragon 835 and 660, the performance will surely fall between the two chipset. Each cluster will have 32kb of L1 cache, 128kb of L2 cache, and 1024kb of L3 cache respectively.

The Chipset will be coupled with Adreno 615 GPU and will perform between 430 and 650 MHz with a 700 MHz turbo mode for extreme graphics operations. The GPU will support the trendy dual camera arrangement and is likely to support the ongoing four camera arrangement phones, but the maximum resolution is still in the dark. For the reference design for the Snapdragon 670 chipset, it comprised of 13MP + 23 MP setup.
The Chipset will be debuting with Qualcomm X2x modem, which will be capable of reaching a maximum speed of 1Gbps (unconfirmed). It should also support UFS memory and older eMMC. 5.1 flash standard.

Though Qualcomm hasn’t officially announce the Snapdragon 670 Chipset, but there is a high chance that is getting prepared to do so in the upcoming MWC 2018 event. Rumors also had it that the chipset will start featuring in phones in the first quarter of 2018, so launching at World Mobile Congress will definitely make sense.




Leave a Reply

This site uses Akismet to reduce spam. Learn how your comment data is processed.