The Dimensity 7200 is MediaTek’s first chipset in the new Dimensity 7000 series. The Dimensity 7200 has cutting-edge Al imaging technologies, strong gaming optimizations, and outstanding 5G speeds, all while incorporating deeply ingrained power reductions for prolonged battery life. Let’s take a look at what Mediatek has integrated with this chip.
Features of the Dimensity 7200
The Dimensity 7200 uses the same TSMC 4nm second-generation process as the Dimensity 9200 and is excellent for ultra-slim designs in a wide range of form factors. The octa-core Processor combines two Arm Cortex-A715 cores with up to 2.8GHz operating speeds with six Cortex-A510 cores, allowing users to multitask with ease and benefit from top performance in every program.
MediaTek’s built-in Al Processor Unit (APU) optimizes the efficiency of Al workloads and Al-fusion processing to further optimize power and performance. “The MediaTek Dimensity 7000 series will be critical for mobile gamers and photography aficionados who want to squeeze the maximum battery life out of their phones without sacrificing performance,” said CH Chen, Deputy General Manager of MediaTek’s Wireless Communications Business Unit.
The MediaTek HyperEngine 5.0 technology for gamers includes Al-based Variable Rate Shading (VRS) for power savings, CPU and GPU smart resource management for longer battery life, and other enhancements for seamless gaming. The processor also has a strong Arm Mali G610 GPU, which allows for rapid reaction times and high frame rates.
The Dimensity 7200 features 200MP primary cameras for epic photography using MediaTek’s Imagiq 765 and a 14-bit HDR-ISP. The chipset supports 4K HDR video capture and even lets users shoot material from two cameras at Full HD quality while keeping everything in focus using all-pixel autofocus technology. The chipset has motion-compensated noise reduction to ensure users can shoot spectacular photos at night and in low-light conditions.
The APU also enables strong Al-Camera features including real-time portrait beautifying. The Dimensity 7200 has a 3GPP Release-16 standard Sub-6GHz 5G modem with up to 4.7Gbps downlink and triband Wi-Fi 6E connection as well as next-generation Bluetooth 5.3. MediaTek’s 5G modem and the fully integrated 5G modem
The UltraSave 2.0 technology suite ensures the highest cellular power efficiency in the industry. The chipset enables 2CC Carrier Aggregation and Dual 5G SIM with dual VONR for dependable coverage everywhere. The Dual SIM feature also allows customers to have two connections, making it simple to take professional and personal calls from a single smartphone.
Here are some other features of the Dimensity 7200:
- Up to 6400Mbps memory frequency and UFS 3.1 for maximum storage.
- MediaTek MiraVision Display with HDR supports the latest standards including HDR10+, CUVA HDR, and Dolby HDR.
- Up to Full HD+ and 144Hz for brilliant displays.
- AI SDR-to-HDR video playback for enhanced multimedia experiences.
- Bluetooth LE Audio technology and Dual-Link True Wireless Stereo Audio for wireless earbud support.
Dimensity 7200 will power 5G devices that will hit the market in the first quarter of 2023. Please visit the link below to learn more about MediaTek’s Dimensity portfolio.
