Google will not release the Pixel 9 and Pixel 9 Pro until the second half of the year, but we already know some details of the phone. It will debut with the Tensor G4, which from reports, will have improved heat management and power efficiency.
Pixel phones from the 6 series have had issues with heat management. With the Pixel 8 and Pixel 8 Pro, Google made some improvements, thanks to the FOWLP (Fan-out Water-level packaging) method used in designing the Tensor G3. Interestingly, the Tensor G4 will use a newer version of the packaging, meaning that the heat management and efficiency of the Pixel 9 and Pixel 9 Pro will see a substantial improvement.
According to reports, Google and Samsung are working on the Tensor G4, which will use Samsung’s latest 4nm process and packaging method. It is the same as the Exynoss 2400 on the Galaxy S24, which probably managed to surpass all expectations. Hopefully, we will see a substantial improvement with the Tensor G4, as previous Tensor SoCs have failed to match the performance of flagship processors from Qualcomm and Apple.
Meanwhile, Tensor G4 is the last chip that Google will design in collaboration with Samsung. The tech company plans to move over to TSMC for the design of Tensor G5, which will debut in 2025. They are known for better power efficiency, as we have seen by the processors produced by TSMC for Qualcomm and MediaTek.
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