Author: Adimorah Jude

The last couple of years have seen AI gradually taking over the Smartphone world, with almost all the recently launched phones debuting fully equipped with AI functionalities. Therefore, QUALCOMM has continued to develop new chips to bridge the gaps between the premium and lower-tier device in terms of AI capablities. Released last year November is QUALCOMM Snapdragon 632, one of the latest chip under the lower-tier segment. According to Qualcomm, the chips brings some amazing features expected in a mobile platform. It includes mainly Artificial Intelligence, 4k video shooting, mainstream gaming, and faster LTE speed. Meanwhile, Snapdragon 632 is built…

Qualcomm Snapdragon 710 SoC tries to bridge the gap between lower-tier Snapdragon 670 and premium 845 SoC. The chip is the first mobile platform from the 700 series and promises 2x overall performance on mid-range smartphones with the help of AI. It implements Kryo architecture to be on par with Snapdragon 845 and is also built in the same 10nm process. The Octa-core chip includes two Kryo 360 (modified cortex-A75) clocking at 2.2GHz and six Kryo 360 (modified cortex-A55) clocking at 1.7GHz. Its coupled with all new Adreno 616 GPU to support the lifelike display and to deliver efficient 3D…