Qualcomm and MediaTek have unveiled their latest mobile chipsets, the Snapdragon 8S Gen 3 and Dimensity 8300 respectively. While both chipsets are targeted at the premium smartphone market premium devices, the two vary in terms of features and performance.
Due to that, we will be comparing and exploring the differences between the Snapdragon 8S Gen 3 and MediaTek Dimensity 8300 to help you make an informed choice when purchasing a smartphone.
Fabrication Technology and CPU Configuration
Both the Snapdragon 8s Gen 3 and Dimensity 8300 are built on the same TSMC 4nm process node, ensuring efficiency and performance. However, when it comes to CPU configuration, notable distinctions emerge. The Snapdragon 8 Gen 3s boasts a more robust CPU setup with five high-performance cores and three power-efficient cores. In contrast, the MediaTek Dimensity 8300 features four high-performance cores and four power-efficient cores.
GPU Capabilities and AI Performance
In terms of GPU capabilities, the Snapdragon 8s Gen 3 comes with an Adreno 735 GPU which is tailored for HDR gaming and supports real-time ray tracing. On the other hand, the Dimensity 8300 is equipped with a 6-core Mali-G615 GPU, providing a 60% increase in GPU peak performance and a 55% reduction in power consumption.
Despite this discrepancy, both chipsets come with on-device GenAI capabilities, allowing AI tasks to be performed without an internet connection.
Modem Performance and Connectivity
The modem performance is another area where these chipsets differ significantly. The Snapdragon 8s Gen 3 utilizes the older Snapdragon X70 5G modem, offering slightly lower peak speeds of up to 5 Gbps.
In contrast, the Dimensity 8300 supports ultra-fast speeds with a built-in 3GPP Release-16 standard 5G modem which utilizes scenario-specific optimizations to provide improved connectivity in environments that have weaker connections. The modem supports 3CC carrier aggregation, capable of achieving peak download speeds of up to 5.17Gbps.
Moreover, while both chipsets support Bluetooth technologies like Bluetooth 5.4 and Bluetooth LE Audio, the connectivity options vary in terms of cellular modems.
Camera Capabilities and Video Recording
When it comes to camera capabilities, the Snapdragon 8s Gen 3 and the Dimensity 8300 are equally impressive. The Snapdragon 8s Gen 3 tends to elevate mobile photography, allowing for 200-megapixel captures and featuring a triple 18-bit ISP for superior image processing. The chipset also features Qualcomm’s AI-enhanced face detection and low-light vision technology.
On the other hand, the Dimensity 8300 supports triple, dual, or single cameras with a maximum resolution of up to 320MP. With that, this chipset opens up the possibilities for capturing vivid and detailed images.
Memory Support and Storage
Both chipsets support LPDDR5X memory and UFS 4.0 storage technology. However, there are slight differences in memory performance between the two. The LPDDR5X memory on the Snapdragon 8s Gen 3 operates at speeds up to 4200MHz, while the Dimensity 8300 offers slightly faster performance with memory channels capable of reaching up to 8533Mbps.
In terms of memory storage, both the Snapdragon 8s Gen 3 and the Dimensity 8300 support up to 24GB LPDDR5X memory.
Availability and Adoption
It will take a few months before smartphones powered by the Snapdragon 8s Gen 3 become available. Xiaomi Civi 4 Pro is the first phone to debut with the new SoC, and we hope to get the real-life performance soon.
Meanwhile, the Dimensity 8300 is running the POCO X6 Pro that arrived at the end of 2023, starting below $400. It means both SoCs have a similar performance, with devices running them going for almost the same price. However, we expect more devices to debut with Snapdragon 8s Gen 3 on the global market.
Final Words
The Snapdragon 8S Gen 3 and Dimensity 8300 offer impressive features for premium smartphones. While the Snapdragon 8S Gen 3 is still in the early stages of adoption, the Dimensity 8300 is already being adopted by phone manufacturers. Keep an eye out for further updates and developments in this exciting chipset competition.
